Another name for integrated circuit 选择语言:从中文简体中文翻译英语日语韩语俄语德语法语阿拉伯文西班牙语葡萄牙语意大利语荷兰语瑞典语希腊语捷克语丹麦语匈牙利语希伯来语波斯语挪威语乌尔都语罗马尼亚语土耳其语波兰语到中文简体中文翻译英语日语韩语俄语德语法语阿拉伯文西班牙语葡萄牙语意大利语荷兰语瑞典语希腊语捷克语...
aIntegrated circuit:Another name for a chip,an integrated circuit(IC)is a small electronic device made out of a semiconductor material. 集成电路:另一个名字对于芯片,集成电路(集成电路)是从半导体材料做的一个小电子设备。 [translate] 英语翻译 日语翻译 韩语翻译 德语翻译 法语翻译 俄语翻译 阿拉伯语翻译...
Although 3D integrated circuit technology has typically been used to solve specific design goals, it has great potential for protecting intellectual property from theft or unwanted modification while at a third-party fabrication facility. We present analysis of a technique for splitting a design across...
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In one embodiment, an integrated circuit includes a heat generating structure within a dielectric region and one or more substantially horizontally arranged heat dissipation layers within the dielectric region. Each heat dissipation layer includes electrically inactive thermally conductive structures, at least...
Adjusting units cause an adjustment of the output voltage of the amplifier in the former operating phase, and cause a shift of the output voltage of the amplifier in the latter operating phase. An independent claim is also included for a method for operating an integrated circuit. 展开 ...
Type Name Latest commit message Commit time README.md _config.yml README.md Another 85+ Ideas for Computing This is a list of new ideas since my last 100 ideas. I hope you enjoy them as much as I did thinking about them and writing them down. Follow me on Twitter You can read...
The TLE9471-3ES V33 is a monolithically integrated circuit in an exposed pad PG-TSDSO-24-1 (150 mil) power package. The device is designed for various CAN automotive applications as main supply for the microcontroller and as interface for a CAN bus network including the CAN ...
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The heat sink has a base (40) for receiving the heat from an integrated circuit (A1), and heat dissipators (41) attached on the base independent of one another. The base has a plan surface for mounting on a surface of the circuit. The transition from the base to the heat dissipators...