Sign in to download hi-res image Fig. 6. (a) The two-tier multi-dimensional access M3D SRAM cell [45]. (b) The two-tier multiple row activation (MRA) M3D SRAM cell [46]. In 2D-IC, a non-negligible issue of in-memory processing is its reliability and robustness. In the entire...
Because a single MOSFET is used instead of many MOSFETs used for SRAM in Fig. 10, a dynamic RAM occupies a much smaller area. Thus in the same chip area of a static RAM, a dynamic RAM can be packed about 4–10 times more, depending on the technology, but SRAM is usually much ...
In this work, we propose a circuit architecture that integrates monolayer MoS 2 transistors in a two-transistor鈥搊ne-capacitor (2T-1C) configuration. In this structure, the memory portion is similar to a 1T-1C Dynamic Random Access Memory (DRAM) so that theoretically the cycling endurance ...
The growing computational demand in artificial intelligence calls for hardware solutions that are capable of in situ machine learning, where both training and inference are performed by edge computation. This not only requires extremely energy-efficient architecture (such as in-memory computing) but ...
In this chapter, we will provide an overview of the current state of the art, recent progress and future directions in NFC based wireless power transfer, with the special focus on near field communications operating at 13.56 MHz. Keywords wireless power transfer near field communication inductive ...
Computers, Materials & Continua is a peer-reviewed Open Access journal that publishes all types of academic papers in the areas of computer networks, artificial intelligence, big data, software engineering, multimedia, cyber security, internet of things, materials genome, integrated materials science, ...
a gamer requiring fast load times, or just someone who wants a more responsive computing experience, an SSD can make a noticeable difference in your day-to-day use. The transition from HDD to SSD is often described as one of the most impactful upgrades a user can make to their computer ...
The same industry roadmap also predicts that by that time, microprocessors will utilize An Overview of Advanced Failure Analysis Techniques for Pentium® and Pentium® Pro Microprocessors 1 Intel Technology Journal Q2 '98 full flip-chip technology, instead of current wirebond assembly and packag...
2 1 Memory overview The memory hierarchy is commonly displayed as a pyramid, as shown in Fig. 1, where capacity increases and latency decreases from top to bottom. The goal of the memory hierarchy is to have information that has been recently used or will be used rapidly at the top of ...
5.1 Memory System Features Overview The Cortex™-M3 processor has different memory architecture from that of traditional ARM processors. First, it has a predefined memory map that specifies which bus interface is to be used when a memory location is accessed. This feature also allows the processo...