NCU Diagram 2 AMD's Vega 10 GPU uses the GCN 5.0 architecture and is made using a 14 nm production process at GlobalFoundries. With a die size of 495 mm² and a transistor count of 12,500 million it is a very big chip. Vega 10 supports DirectX 12 (Feature Level 12_1). For GPU...
LDS DiagramAMD's Banks GPU uses the GCN 1.0 architecture and is made using a 28 nm production process at TSMC. With a die size of 56 mm² and a transistor count of 690 million it is a very small chip. Banks supports DirectX 12 (Feature Level 11_1). For GPU compute applications, ...
AMD's new RDNA architecture is a major advancement over and above GCN. If it delivers the improvements AMD has promised, it'll be the company's most important GPU launch since 2012. Let's take a look at what AMD has brought to the table.
全新RDNA GPU 微架構 ▲ AMD 「Navi 10 」GPU Block Diagram 全新「RDNA」針對 Compute Unit 作出重新設計,「Navi 10」繪圖核心擁有 2 個 Shader 引擎共享前端、每個 Shader 引擎擁有 2 組 Graphics Array 運算群,每個 GA 運算群內含 5 個 Dual Compute Unit (DCU) 並共享 L1 Cache、Rasterizer、ROP、Prim ...
AMD Radeon R9 290 'Hawaii' GPU Block Diagram Detailed The Radeon R9 290X and Radeon R9 290 would both feature the Hawaii GPU architecture. The Hawaii chip measures at a 438mm2which is larger 24% larger compared to the Tahiti chip which measures at 389mm2. AMD spent alot of time tweaking...
The picture, which we'll reproduce below, seems to have been taken during an AMD presentation, and it clearly shows a diagram of the Navi 31 GPU, which is the biggest RDNA 3 graphics processor. Image: Videocardz On the diagram are a number of fascinating technical details, like discussion...
两个整数部分一个浮点部分，两个核心贡献一个浮点模块，据说当时AMD认为浮点功能交给GPU就好了，CPU应该...
The AMD Navi 31 GPU, the flagship RDNA 3 chip, would power the next-gen Radeon RX 7900 XT graphics card. We have heard that AMD will drop CU (Compute Units) in favor of WGP (Work Group Processors) on its next-gen RDNA 3 GPUs. A preliminary block diagram of AMD's next...
WHITE PAPER | INTRODUCING AMD CDNA™ 3 ARCHITECTURE 3 Figure 2. Block diagram of the AMD Instinct™ MI300A APU and MI300X discrete GPU CHIPLET ARCHITECTURE REPARTITIONING The AMD CDNA™ 2 architecture harnessed advanced packaging to couple homogeneous dies into a dual- processor packa...
The following image shows the block diagram of an OAM package that consists of two GCDs, each of which constitutes one GPU device in the system. The two GCDs in the package are connected via four AMD Infinity Fabric links running at a theoretical peak rate of 25 GT/sec, giving 200 GB/...