Aluminum nitride is a safe alternative to BeO substrates. Formula or Composition AlN Dielectric Constant () 8.9 Dissipation Factor(a.k.a. loss tangent, or tan ) 0.0005 Temperature Coefficient of ppm/°C Bulk Resistivity μΩ-cm Temperature Coefficient of Resistivity (TCR) ppm/°C Mass Density ...
Joseph WeimerAir Force Research Laboratory, Wright Patterson AFB, OH 45433John Wiley & Sons, LtdK.R. Bray, R.L.C. Wu, S. Fries-Carr, and J. Weimer, "Aluminum nitride dielectrics for high energy density capacitors", Ceramic Transactions 179, 45-55, (2006)....
Material Properties of Aluminum Nitride Substrate/Wafer Property Content Property Index Density(g/cm3) 3.335 Resistance to Thermal Shock No Cracks Thermal conductivity(30°C, W/m.k) ≥170 Linear expansion coefficient (/°C, 5°C/min, 20-300°C) 2.805×10-6 Flex...
Materials Aluminum Nitride(Aln) Size 20*15*50mm/as Per Request Purity 98% Density 3.3/Cm3 Surface Quantity 0.3-0.5um Feature High Thermal Conductivity Keyword High Purity Aln Sleeve Aluminum Nitride Ceramic Tu Transport Package 1.Plastic Air Cushion Film 2.Foam M...
Title: Aluminum Nitride CAS Registry Number: 24304-00-5 Molecular Formula: AlN Molecular Weight: 40.99 Percent Composition: Al 65.82%, N 34.17% Literature References: Semiconductor material. Prepn: F. Briegleb, A. Geuther, Ann. 123, 228 (1862). Lattice structure: H. Ott, Z. Physik. 22,...
The ALN wafer is the best choice for a wide range of industrial insulating heat sink material of high power machinery and equipment such as high-frequency equipment substrate, high power transistor module substrate, high-density hybrid circuits, microwave power devices, power s...
Additionally, aluminum nitride is attacked by acids and alkalis. This material is an electrical insulator. Doping improves its electrical conductivity. AIN displays piezoelectric properties. Table 1. Typical Physical and Mechanical Properties of Aluminium Nitride PropertyValue Density (g.cm-3) 3.32 ...
As Fired High Thermal Conductivity AlN Aluminum Nitride Ceramic Substrate Product Introduction Aluminum nitride (AlN) is an advanced ceramic material for high-power hybrid semiconductor packaging where high thermal conductivity is required. AlN ceramic substrates have a thermal c...
Aluminum Nitride is a compound that has high thermal conductivity and is used as a heat sink material. It can also be used as a reinforcement to increase thermal conductivity in other materials. From: Reference Module in Materials Science and Materials Engineering, 2016 ...
6. The semi-conductor device according to claim 1, wherein the sintered aluminum nitride has a density of 90% or more of its theoretical density. 7. The semi-conductor device according to claim 1, wherein the sintered aluminum nitride has a thermal conductivity of 0.2 cal/cm.sec.°C. or...