百度试题 结果1 题目智慧职教: ___ is a copper alloy that contains tin.相关知识点: 试题来源: 解析 Bronze 反馈 收藏
aBrass is an alloy of copper and zinc. It has much better abrasion resistance, better corrosion resistance and lower electrical conductivity as compared with copper. Phosphor bronze is an alloy of tin, phosphorus and copper; it is corrosion, wear and tear resistant, but it is not suitable for...
The present invention relates to a tin-containing copper alloy, comprising Sn: 0.01 ~ 16mass%, Zr: 0.001 ~ 0.049mass%, P: 0.01 ~ 0.25mass%, Cu: remaining amount; and f0 = [Cu] -0.5 [Sn] -3 [P] = 61 ~ 97, f1 = [P] / [Zr] = 0.5 ~ 100, f2 = 3 [Sn] / [Zr] = ...
copper tin alloy 美 英 un.铜锡合金 例句 释义: 全部,铜锡合金
A fuse wire is made of tin alloy because it has low melting point, so that it may melt easily, whereas a copper wire cannot be used as a fuse wire because it has a high melting point due to which it will not melt easily when a short circuit takes place. Was this answer helpful?
Copper alloy and process for its preparation Process for the preparation of a substantially homogeneous alpha phase copper-nickel-tin alloy comprising copper and 4-18% by weight of nickel and 3-13% by weight of tin, comprising atomizing a molten alloy having the before-indicated co... C Jeroe...
网络释义 1. 锡铜合金 纳米铜锡合金,Copper-tin alloy... ... ) Cu-Sn alloy 铜锡合金 )tin-copper alloy锡铜合金) Sn-Cu alloy 锡-铜合金 ... www.dictall.com|基于4个网页 例句
For example, brass is a copper–zinc alloy, and bronze is a copper–tin alloy. These alloys are extensively used in piping, electrical applications, architecture, the building industry, household products, coinage, biomedical applications, chemical applications and musical instruments....
PROBLEM TO BE SOLVED: To provide a tin- and copper-containing plating bath which hardly gives rise to substitution deposition of copper to a tin anode, is low in the dependence of a plating film composition on current density, is good in bath stability and hardly gives rise to clouding.;...
The nucleation and growth of electrochemically deposited copper on PVD copper and TiN using alkaline baths The nucleation and growth of constant potential electrochemically deposited copper was investigated using ethylenediaminetetraacetic acid (EDTA) and NH3 copper complexed alkaline baths. The mechanisms of...