Thermal expansion properties of 6061Al Alloy reinforced with SiC particles or short fibers. Int J Thermophys 1988;9:861-71.T.A. Hahn and R.W. Armstrong: Int. J. Thermophys. , 1988, vol. 9 (5), pp. 861–71.Thermal expansion properties of 6061 Al alloy reinforced with SiC particles ...
Thermal conductivity ( W m⁻1 K⁻1 ) 152.00 - 169.00 Mechanical Properties(机械性能) Elongation at break ( % ) 12.0 -25.0 Tensile strength ( MPa ) 124.00 - 290.00 Physical Properties(物理性质) Density ( g cm⁻3 ) 2.700 其他参数 公差 长度 <100mm ±1mm ≥100mm +2% / -1% 直径 ...
6061-T6 / 6061-T651 310 276 95 12 物理性能分析(Typical Physical Properties) 铝合金牌号及状态 热膨胀系数(20-100℃)μm/m·k 熔点范围(℃) 电导率20℃(68℉) (%IACS) 电阻率20℃(68℉) Ωmm2/m ALLOY AND TEMPER Average Coefficient Of Thermal Expansion ...
It is demonstrated that the SiCw/6061Al composite has a good combination of room temperature specific strength and modulus, as well as excellent thermal properties. Extrusion improves the mechanical properties of the composite, and transforms an isotropic composite to an anisotropic one. The fracture...
MaterialData_AL 6061 T6 Tensile Strength, Ultimate Tensile Strength, Yield
02 January 2014 Abstract In This study to investigate the features of Cyclic Constrained Groove Pressing (CCGP) structure formation in the Al6061 alloy during severe plastic deformation using the mode of CCGP with low strain rate and to estimate its thermal stability and super plastic properties. ...
SiCp/6061Al compositesthermal propertiesmechanical properties采用放电等离子烧结技术成功制备具有高热学和力学性能的50 vol.%SiCp/Al复合材料,研究烧结温度对复合材料热导率,热膨胀系数和抗弯强度的影响.结果表明,在520℃下烧结获得的复合材料,导热系数为189 W/(m·K),热膨胀系数(50～200℃)为10.03×10-6 K-1,...
The addition of 4% Cu in Al6061 is more or less comparable to the composition duralumin, which are widely used in aerospace applications. SiCis hard and has linear thermal expansion at high temperature. With reinforcement of SiCin Al6061-Cu alloy, it can be postulated that hardness of MMC ...
6061-T6 / 6061-T651 310 276 95 12 物理性能分析(Typical Physical Properties) 铝合金牌号及状态 热膨胀系数(20-100℃)μm/m·k 熔点范围(℃) 电导率20℃(68℉) (%IACS) 电阻率20℃(68℉) Ωmm2/m ALLOY AND TEMPER Average Coefficient Of Thermal Expansion ...
A: High heatsink surface;Good aerodynamics;Good thermal transfer within the heatsink;Perfect flatness of the contact area;Good mounting method. You can start with a small trial. Just send me your drawings! Look forward to hearing from you. Se...