利用 TEM 技术进一步表征了未修饰和修饰的二氧化硅纳米颗粒（图 2）。用 Simple PCI 6 测定的未改性（计数：nA = 1056）、氟烷基硅烷改性（nB = 845）和辛基硅烷改性（nC = 1183）二氧化硅纳米粒子的平均直径（di，i = A、B 或 C）分别为（114.69 ± 0.21）nm、（115.90 ± 0.24）nm 和（116.10 ...
使用TEM 进一步表征未改性和改性的二氧化硅纳米粒子(图 2)。通过 Simple PCI 6 测定的未改性(计数数量:nA =1056)、氟烷基硅烷改性(nB = 845)和辛基硅烷改性(nC = 1183)二氧化硅纳米粒子的平均直径(di,i = A、B 或 C)分别为 (114.69 ± 0.21) nm、(115.90 ± 0.24) nm 和 (116.10 ± 0.20) nm。统...
Janssens, K.et al.(2003) J. Biol. Chem.278:7718. Long Name Latency-associated Peptide Entrez Gene IDs 7040 (Human) Alternate Names CED; DPD1; LAP (TGFbeta 1); LAP (TGF-beta 1); LAP; TGFB; TGFB1; TGFbeta; transforming growth factor beta 1 ...
用 Simple PCI 6 测定的未改性(计数:nA = 1056)、氟烷基硅烷改性(nB = 845)和辛基硅烷改性(nC = 1183)二氧化硅纳米粒子的平均直径(di,i = A、B 或 C)分别为(114.69 ± 0.21)nm、(115.90 ± 0.24)nm 和(116.10 ± 0.20)nm。统计分析显示,dA 和 dB/dC 之间的差异显著(pA,B = 1.13 × 10^(-4...
273-278 ℃ 处的急剧吸热相变可归因于氟碳部分的链熔融转变。烃连接子的分解开始于 318 ℃。连接体降解放热转变之后,氟碳残留物(在低于 500℃ 的温度下热稳定)的蒸发立即引起吸热转变。FNPs 的降解温度高于 Teflon AF 2400(240℃)的玻璃化转变温度 (Tg)。因此,Teflon AF 2400 和 FNPs 的复合膜在 Teflon AF...
ME2807A25M3G SOT-23 UCC28070APW UCC28065DR UCC35701D UCC28C 安装类型 030-1954-000、04025A6R8CAT2A、TLS810A1LD、W25Q128JVEQ、TLSR9517DER、04025A8R2DAT2A、KIA431、TLSR9511B、KMPC8541VTAPE、7157-6801-30、6N135S-TA1、KMPGG0M0JM、KIA278R06PI、KMR7X0001MB511、KMPC8544EVTANG、71600-006LF...
Gate-source leakage current IGSS 100 nA VGS=30 V -100 VGS=-30 V Drain-source leakage current IDSS 10 μA VDS=650 V, VGS=0 V Gate resistance RG 2.1 Ω ƒ=1 MHz, Open drain Dynamic Characteristics Parameter Symbol Min...
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Gate-source leakage current IGSS 100 nA VGS=30 V -100 VGS=-30 V Drain-source leakage current IDSS 10 μA VDS=650 V, VGS=0 V Gate resistance RG 2.1 Ω ƒ=1 MHz, Open drain Dynamic Characteristics Parameter Symbol Min. Typ. Max. Unit Test condition Input capaci...