AEC-Q200-REVC June17,2005 ComponentTechnicalCommittee AutomotiveElectronicsCouncil Page105of111 METHOD-005 PASSIVECOMPONENT BoardFlex/TerminalBondStrengthTest 1.0SCOPE 1.1DESCRIPTION: ThisspecificationestablishestheprocedureandcriteriaforevaluatingtheTerminalStrengthofa ...
待测的全部元件和批次列出在AEC-Q200规范的表1。 3.0测试程序: 3.1样品尺寸: 待测的全部元件和批次列出在AEC-Q200规范的表1。 3.2测试环境: 1.安装在一块由供应商提供的FR4板上的待测元件需满足下列条件: 2.待测元件的焊盘类型满足供应商的标准 3.元件安装在一块100mm×40mm FR4 PCB板,板厚为1.6mm±0.2...
AEC_Q200-005 AEC-Q200-REV C June 17, 2005 Component Technical Committee Automotive Electronics Council Page 104 of 111 Attachment 5 PASSIVE COMPONENT SURFACE MOUNTED DEVICES Board Flex / Terminal Bond Strength Test
Board Flex 板弯曲 21 AEC-Q200-005 只适用于MLCC,至少60秒的支撑时间 1 Terminal Strength(SMD) 端子强度(表面贴装元件) 22 AEC-Q200-006 / 1 Electrical Transient Conduction 瞬时电传导 30 ISO-7637-1 脉冲测试1~3 1 注意:预前应力电气测试也作为电气特性。1000小时试验过程中需要在250和500小时进行间隔...
AEC - Q200-005 - Rev-A - Board Flex - Terminal Bond Strength Test板弯曲强度测试.pdf,AEC-Q200-005 REV A June 1, 2010 Automotive Electronics Council Component Technical Committee ATTACHMENT 5 AEC - Q200 - 005 BOARD FLEX TEST Page 1 of 5 AEC-Q200-005 REV A
多层压敏电阻器AEC-Q200案例、EIA/IPC/JEDEC J-STD-002E可焊性Solderability、AEC-Q200-006 REV A端子强度Terminal Strength (SMD)、AEC-Q200-005 REV A板弯曲Board Flex 1. 可焊性(Solderability) 1.1 试验信息 样品数量:15 pcs * 1 lot 参考方法:EIA/IPC/JEDEC J-STD-002E ...
REV A June 1, 2010 ATTACHMENT 5 AEC - Q200 - 005 BOARD FLEX TEST Page 1 of 5 Automotive Electronics Council Component Technical Committee AEC-Q200-005 REV A June 1, 2010 NOTICE AEC documents contain material that has been prepared, reviewed, and approved through the AEC Technical Committee....
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