Shifting away from focus on 3D IC and TSV processes, this year's Advanced Packaging Conference, at SEMICON Europa, titled "Technologies, Manufacturing And Supply Chain", will focus on more immediate issues facing the back-end sector of the semiconductor industries. The conference takes place on ...
(02) Laser processing technology (03) Intelligent Manufacturing Technology (04) Additive Manufacturing Technology (05) Microelectronics packaging, testing and manufacturing technology (06) Smart Construction Technology (07) Precision ultra-precision machining technology (2) New materials and Advanced Materials...
Two Advanced Packaging Projects Signed at 2024 Haikou Investment Conference On November 18, the 2024 China Haikou Industrial Investment Conference took place at the Hainan International Convention and Exhibition Center. Two advanced packaging projects were signed during the event: –Ruichips’ Haikou Compre...
In this research work, we investigate the feasibility of lowering the bonding temperature by refining the copper surface with the application of a self ass... DF Lim,Singh,FA Xiao,... - International Microsystems, Packaging, Assembly & Circuits Technology Conference 被引量: 22发表: 2009年 Adva...
Nanotechnology in Agriculture, Water treatment and Food Industry.Nanotechnologyapplications are being investigated by and by, attempted, and on occasion recently applied across the entire degree of food advancement, from water treatment, cultivation to food planning, packaging, and food adaptability. ...
Effects of Application of Barcodes in Wafer Warehouse Process on Work Efficiency and Job Satisfaction-A Case Study of A Semiconductor Packaging and Testing Company A Ming-Lang Wang, Chien-Lung Chen Wafer warehouses are the first station in a semiconductor packaging and testing company to store waf...
research team of Sun Rong has condensed the scientific issues of electrical, thermal and mechanical aspects of electronic packaging materials, and aimed at breakthroughs in key technologies. He adhered to the complete work of materials-process-devices and carried out a series of basic research on ...
-Authors must make sure that their submissions do not substantially overlap work which has been published elsewhere or simultaneously submitted to a journal or another conference with proceedings. -All submitted paper should be focused on one of the conference topic areas. ...
It’s becoming clear that silicon interposer bridges must be as small as possible because of costs. An analysis by Amkor engineers revealed that thinner active dies in the FOCoS bridge construct are more susceptible to warpage. The work also pointed to the positive effects of using molding compou...