Further, by combining the adhesive film with a dicing tape in the form of a laminate, the adhesive film may be used favorably as an adhesive film with dicing tape. A dicing tape is a tape that is used mainly in the process of cutting wafer using a dicing saw to thereby divide integrate...
The curves show the typical behavior of a dynamic shear test [40], with a linear initial zone, which allows to determine the elastic modulus, a maximum stress that defines the strength of the adhesive related to its internal cohesion, and a deformation up to failure that is a measure of ...
used to evaluate the impact of vapour-resistant adhesive joints related to the drying of built-in moisture. The simulation programs WUFI 2D and WUFI Mould Index VTT were used to model scenarios for moisture transport and risk for mould growth. Laboratory results show that the vapour resistance ...