1. 丝印与焊盘之间间距规则 Silkscreen Over Component Pads Constraint(丝印与焊盘):改为1mil 2. 焊盘与焊盘之间间距规则 Minimum Clearance(最小间距):10mil改为6mil或更小 3. 阻焊之间间距规则 Minimum Solder Mask Sliver:10mil改为1mil 4. 丝印与丝印之间间距规则 Silk To S... ...