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A portable notebook computer has a shock/vibration testing system incorporated therein and including first and second memory chips and a miniature accelerometer mounted on the computer motherboard and interconnected to the power supply board and storage battery portions of the computer by a power ...
In particular, the areas suitable for placement of IC components include: (1) top surface 50 of the thick portion 12 of the frame; (2) thin portion 48 of the frame located above the proof mass; and (3) stress-free top portion 62 of the proof mass. As it can be seen from FIG. ...
To ease component placement, the output filters for each channel are placed on the TLV1544 EVM. For standalone testing of the signal conditioning circuit without the TLV1544 EVM, temporarily place the filter components on board 1 and board 2. Remove them for final integration. 15 3-V ...
Hz. The spectrum continues to tail off at higher frequencies (not shown). The zero vibration spectrum is essentially zero (orange line) on this scale. The total FFT time for 2048 bins is 4.0 ms, 5x (expected from Nlog2(N) dependence of FFToperationson bin size) the 800 us for 512 ...
although the EE and CMEE estimated by ankle-mounted devices have high validity, they have poor reliability due to the characteristics of VM activity counts. To avoid bias, an appropriate EE estimation equation is required when the different vibration counts caused by wearing location are not conside...
Computer Aided Design and Eeffects of Beam Placement in Bulk Micromachined Piezoresistive MEMS Accelerometer for Concrete SHM ApplicationsMEMSStructural health monitoringPiezoresistiveSingle axis AccelerometerStructural Health Monitoring (SHM) using non destructive testing generally involves measurement of shift in ...
Finite Element Analysis (FEA) is performed for three common accelerometer locations to determine how their placement affects the frequencies and mode shapes for the RC and results are compared against those without accelerometers. Free vibration experiments are carried out to understand the varia...
Objects of the present invention include provision of a fiber optic accelerometer for use within a harsh environment. The invention may be used in harsh environments (high temperature, and/or pressure, and/or shock, and/or vibration), such as in oil and/or gas wells, engines, combustion cham...
In the previous embodiment, a triaxial accelerometer constructed from an aforementioned sensing structure was presented. Actually, with little variation, this sensor can be converted into a uniaxial accelerometer. Instead of a quadrant placement of four electrode sections near the inner and outer ends ...