TSSOP8 封装 尺寸 DIMENSIONS REF.mm inch MIN.TYP .MAX.MIN.TYP.MAX.A 1.20.047A10.050.150.0020.006A2 0.80 1.00 1.050.0310.0390.041b 0.190.300.0070.012c 0.090.200.0040.008D 2.90 3.00 3.100.1140.1180.122E 6.20 6.40 6.600.2440.2520.260E1 4.30 ...
TSSOP8 封装 尺寸 DIMENSIONS REF.mm inch MIN.TYP .MAX.MIN.TYP.MAX.A 1.20.047A10.050.150.0020.006A2 0.80 1.00 1.050.0310.0390.041b 0.190.300.0070.012c 0.090.200.0040.008D 2.90 3.00 3.100.1140.1180.122E 6.20 6.40 6.600.2440.2520.260E1 4.30 ...
not available D 2.90 3.00 3.10 0.114 0.118 0.122 E 6.20 6.40 6.60 0.244 0.252 0.260 E1 4.30 4.40 4.50 0.169 0.173 0.177 e 0.65 0.0256 K 0° 8° 0° 8° L 0.45 0.60 0.75 0.018 0.024 0.030 TSSOP8 L1 1 0.039 February 2003 1/4 TSSOP8 PACKAGE AND PACKING INFORMATION TAPE REEL SHIPMENT ...
Large-density E²PROMs fit tiny TSSOP8 package.Reports that two 512-kilobit low-voltage serial electrically erasable programmable read only memory (E2PROM) devices from STMicroelectronics are available in packages that measure 4.5 by 3.1 millimeters. Operating at 1.8 volts; Aimed at serial ...
SOP-8是PHILIP公司首先开发的,以后逐渐派生出TSOP(薄小外形封装)、VSOP(甚小外形封装)、SSOP(缩小型SOP)、TSSOP(薄的缩小型SOP)等标准规格。这些派生的几种封装规格中,TSOP和TSSOP常用于MOSFET封装。 8脚mos管工作原理 8脚mos管工作原理及表示符号 根据导通沟道的载流子性质MOS管可分为NMOS管(即N沟道MOS管)与PMO...
The TSSOP-8 package has 45% less footprint area than the standard SO-8. This makes the TSSOP-8 an ideal device for applications where printed circuit board space is at a premium. The low profile (<1.1mm) allows it to fit easily into extremely thin environments such as portable electronics...
mos管sop8是PHILIP公司首先开发的,以后逐渐派生出TSOP(薄小外形封装)、VSOP(甚小外形封装)、SSOP(缩小型SOP)、TSSOP(薄的缩小型SOP)等标准规格。mos管sop8采用塑料封装,没有散热底板,散热不良,一般用于小功率MOSFET。 SOP-8EP封装尺寸图 SOP-8EP封装尺寸:4.9×6.0×1.5 ...
中文标题(翻译):TSSOP8包装大纲,厂牌:迈极,资料类型:Package Outline,封装信息/封装结构图,封装:TSSOP8,语言:英文资料,生成日期:2021/5/17,文档大小:200K
The TSSOP-8 package has 45% less footprint area than the standard SO-8. This makes the TSSOP-8 an ideal device for applications where printed circuit board space is at a premium. The low profile (<1.1mm) allows it to fit easily into extremely thin environments such as portable electronics...
SOP-8封装尺寸 SOP-8为PHILIP公司率先开发,采用塑料封装,没有散热底板,散热不良,一般用于小功率MOSFET。 后逐渐派生出TSOP(薄小外形封装)、VSOP(甚小外形封装)、SSOP(缩小型SOP)、TSSOP(薄的缩小型SOP)等标准规格;其中TSOP和TSSOP常用于MOSFET封装。