(111) oriented nanotwinned copper ((111)nt-Cu) has attracted much attention and shown a good application prospect as Under Bump Metallurgy (UBM) in advanced packaging technology, because of its excellent interconnect performance. However, the research on the microstructure evolution of (111)nt-Cu/...
The article discusses unidirectional growth of microbumps on [111]-oriented and nanotwinned copper (nt-Cu). Researchers fabricated highly oriented [111] Cu grains with densely packed nanotwins by direct-current electroplating with a high stirring rate. According to the team, the [111]-oriented and...
We investigate the growth of Cu films on two different Cu seed layers: one with regular ,111.-oriented grains and the other with very strong ,111.-preferred orientation. It is found that densely-packed nanotwinned Cu (nt-Cu) can be grown by pulsed electroplating on the strong ,111.-...
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In this study, we report a vacuum-free Cu-to-Cu direct bonding technique with a short bonding time of 5 min by using (111)-oriented nt-Cu, with no additional annealing. The bonding is verified through the grain growth occurring across the bonding interface. In addition, we found that ...
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It was found that limited triple junction mobility in nanotwinned structure can result in drag on the motion of the grain boundaries connected during grain growth14 and atomic diffusion9, conferring better thermal stability and electromigration resistance to nanotwinned copper (nt-Cu). These results ...
Direct bonding can also be achieved when a randomly oriented Cu film (top) is bonded to a (111)-oriented nt-Cu film (bottom). The bonded interface exhibited some small voids. The bonding time can be shortened to 30 min by increasing the bonding temperature to 200 °C. Fig. 1c ...
Plastically deformed Cu-based alloys as high-performance catalysts for the reduction of 4-nitrophenol. Catal. Sci. Technol. 2016, 6, 5737–5745. [Google Scholar] [CrossRef] Bauer, J.C.; Mullins, D.; Li, M.; Wu, Z.; Payzant, E.A.; Overbury, S.H.; Dai, S. Synthesis of ...