联茂IT-180ATC是一种先进的高Tg175℃多功能填充环氧树酯,具有高耐热性及耐CAF特性,适合各样应用及可通过260℃高温无铅制程。
IT-180ABS/IT-180ATC High Tg, Low CTE, Multifunctional Filled Epoxy Resin and Phenolic-Cured Laminate & Prepreg --- Process Guideline These process guidelines are the ITEQ interior test experience. We believed that should have helps for the PCB manufacturer. Especially, for those print circuit ...