沪江词库精选电子封装英文怎么写、英语单词怎么写、例句等信息 electronic packaging 相似短语 electronic organ and electronic keyboard 电子琴 electronic jet 电子束,电子流 electronic altimeter 无线电测高计 electronic beam 电子束 electronic box 电子盒 electronic carillon 电子钟琴 electronic commutator...
电子封装 1. Based on ourselves' research activity and literature reports,evaluated and discussed the development trend of compositeelectronic packageand substrate materials. 本文论述了陶瓷颗粒(纤维)增强聚合物基复合电子封装与基板材料体系和性能特点,介绍了复合基板材料的实验研究和理论研究进展情况,根据实验研究...
电子封装技术教材Electronic Packaging Technology英文版电子工程技术教材教程教案电子版电子书下载 下载积分:2800 内容提示: Cluff, K.D., et. al. “Electronic Packaging Technologies”Mechanical Engineering HandbookEd. Frank KreithBoca Raton: CRC Press LLC, 1999c 1999 by CRC Press LLC 文档格式:PDF | ...
新型电子封装Si-Al合金的基础研究 4. The Application of "5S" Activity in Electronic Packaging Industry “5S”管理在电子封装企业中的应用 5. Study on the Reliability of SMT Solder Joint in Electronic Packaging; 电子封装中表面贴装焊点的可靠性研究 6. Thermal Performance Research on Electronics Packa...
SOP是英文Small Outline Package的缩写,即小外形封装。SOP封装技术由1968～1969年菲利浦公司开发成功,以后逐渐派生出SOJ(J型引脚小外形封装)、TSOP(薄小外形封装 2018-08-07 11:11:08 微电子封装技术BGA与CSP应用特点 电子封装是现代电子产品中不可或缺的一部分,它将电子元件组装在一起,形成了一个完整的电子系统...
a一种习惯 One custom[translate] a让我看看你的胸部 Let me have a look your chest[translate] a外加一个薯条 Sur- potato strip[translate] a我会说这句英语 I can speak this English[translate] a半导体电子封装 Semiconductor electron seal[translate]...
1. Flip-chip interconnect technology in optoelectronics device packaging; 倒装芯片互连技术在光电子器件封装中的应用2) Packaging brazing of electronic devices 电子器件封装 例句>> 3) electronics packaging component 电子封装器件 1. The two trends in the electronics packaging component field nowadays ...
电子元器件的几种封装形式(英文简介) CDIP---CeramicDualIn-LinePackage CLCC---CeramicLeadedChipCarrier CQFP---CeramicQuadFlatPack DIP---DualIn-LinePackage LQFP---Low-ProfileQuadFlatPack MAPBGA---MoldArrayProcessBallGridArray PBGA---PlasticBallGridArray PLCC---PlasticLeadedChipCarrier PQFP---Plastic...
微电子封装 1. Microelectronics connecting technology plays an important role in the microelectronics packaging. 微电子连接技术是微电子封装技术中的重要环节。 2. The mechanism, types, process characteristicand the applications of plasma cleaning in microelectronics packaging are presented. 等离子体清洗在干...