封装形式英文缩写 SK-DIP skinny DIP 膜状DIP SL-DIP slim DIP 细长DIP SH-DIP shrink DIP 收缩DIP DIP dual inline package 双列直插式封装` ZIP zigzag inline package 直插式封装SZIP shrink ZIP 缩小的ZIP PGA pin grid array 针栅阵列或柱型封装 HPGA PGA with heatsink 散热的PGA SPGA shrink PGA ...
封装形式英文缩写 SK-DIP skinny DIP 膜状DIP8 O3 d M; p8 F. Q* H | G SL-DIP slim? ?DIP 细长DIP # C4 | I; o6 K ?# @4 B! \SH-DIP shrink??DIP 收缩DIP: k8 V- m. W% C- W DIP dual inline package 双列直插式封装`% e u2 M4 x |4 `; P ZIP zigzag inline package ...
电子元器件的几种封装形式(英文简介) CDIP---CeramicDualIn-LinePackage CLCC---CeramicLeadedChipCarrier CQFP---CeramicQuadFlatPack DIP---DualIn-LinePackage LQFP---Low-ProfileQuadFlatPack MAPBGA---MoldArrayProcessBallGridArray PBGA---PlasticBallGridArray PLCC---PlasticLeadedChipCarrier PQFP---Plastic...
封装知识形式英文缩写.pdf,SK-DIP skinny DIP 膜状 DIP SL-DIP slim DIP 细长 DIP SH-DIP shrink DIP 收缩 DIP DIP dual inline package 双列直插式 封装 ` ZIP zigzag inline package 直插式封装 SZIP shrink ZIP 缩小的 ZIP PGA rid array 针栅阵列或 柱型封装
球栅阵列封装是目前大部分芯片的封装形式,下面哪个为该封装形式的英文简称?( ) A. BGA B. TSOP C. DIP D. PLCC
1、protel99常用元件的电气图形符号和封装形式2009-04-20 13:49protel99常用元件的电气图形符号和封装形式: 1. 标准电阻:RES1、RES2;封装:AXIAL-0.3到AXIAL-1.0 两端口可变电阻:RES3、RES4;封装:AXIAL-0.3到AXIAL-1.0 三端口可变电阻:RESISTOR TAPPED,POT1,POT2;封装:VR1-VR5 2.电容:CAP(无极性电容)、ELE...
可提供多种安装结构(卡盘式,法兰式,板式)和槽罐密封形式(填料密封,机械密封,油密封)。 5. closed temperature measuring device 封闭式温度测量装置 6. closed container mechanically ventilated 封闭式机械通风集装箱 7. ceramic dual in-line package 陶瓷双列直插式封装 8. hot-sealing film bagged packing...
常用的单片机的封装形式双列直插式封装的英文是下面哪一个?A.PLCC:Plastic Leaded Chip CarrierB.QFP: Quad Flat Packag
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