Molding Compound
塑封料Encapsulation:R\C(QMFZ2) 青云英语翻译 请在下面的文本框内输入文字,然后点击开始翻译按钮进行翻译,如果您看不到结果,请重新翻译! 翻译结果1翻译结果2翻译结果3翻译结果4翻译结果5 翻译结果1复制译文编辑译文朗读译文返回顶部 Plastic material Encapsulation: R \ C (QMFZ2)...
塑封料 1. Traditional epoxy molding compounds are facing great challenges for both of the voice from ever-rising environmental protection and the needs of improving property of electronic encapsulating materials for integrated circuit industry. 随着全球环境保护呼声的日益高涨以及集成电路工业对于电子封装材料...
浅析环氧塑封料性能与器件封装缺陷 2. Preparation and Properties of Epoxy Electronic Encapsulating Materials with High Thermal Conductivity and Low Thermal Expansion Coefficient; 高导热低膨胀环氧塑封料的制备及性能研究 3. Temperature Calculation Method Based on Molding Compound Temperature Measurement 以塑封...
塑封料回温的英文缩写是“encapsulant remelt”。塑封料,又称封装材料,是一种用于保护电子元件的特殊材料。它主要应用于微电子器件的封装和保护,可以提高器件的稳定性、可靠性和寿命。 塑封料的回温过程是指在封装过程中,将加热后的塑封料冷却至室温的过程。这一过程对于保证封装质量和性能至关重要。为了实现良好的回温...
塑封料封闭:R \\ C (QMFZ2) 翻译结果5复制译文编辑译文朗读译文返回顶部 塑封料封闭:R \ C( QMFZ2) 相关内容 aLinearity 线性[translate] agreatest happiness 最伟大的幸福[translate] aMonohydrate citric acid 一水化物柠檬酸[translate] aThe AppleCare Protection Plan is a unique service and support solu...
环氧树脂塑封料 1. China epoxy molding compound market is relatively booming, and has been the major aim of vast leading manufacturers in this arena. 相应地,半导体封装用环氧树脂塑封料市场也以相同的速度急剧增长,众多的国际知名环氧树脂塑封料制造商都把中国作为最重要的市场。 更多例句>> 3) Epoxy Re...
百度文库 其他 塑封料回温的英文缩写塑封料回温的英文缩写 The English abbreviation for "塑封料回温" is "WPN" which stands for "Warm-up Plastic Closure".©2022 Baidu |由 百度智能云 提供计算服务 | 使用百度前必读 | 文库协议 | 网站地图 | 百度营销 ...
塑封料流动长度英文 英文回答: Flow Length of Encapsulating Compound. The flow length of an encapsulating compound is a measure of its ability to flow under pressure. It is typically measured in millimeters (mm) and is determined by the compound's viscosity, surface tension, and temperature. The...