基于IPC -7351B 的表贴器件PCB 封装设计 谭安菊，顾炳林 (中国工程物理研究院电子工程研究所，四川 绵阳 621900)摘要：为解决在PCB 设计过程中可制造性和产品性能之间折中考虑的问题，依据IPC -7351B 标准，对表贴器件 PCB 封装进行设计。结合IPC -7351B 标准、可制造性和可靠性等要求，通过对标准封装的SMD ...
In order to solve the problem of compromise between manufacturability and product performance in PCB design process, the PCB packaging of surface mount components was designed according to IPC-7351B standard. According to the requirements of IPC-7351B standard, manufacturability and reliability, by ...