6.4 Thermal Information THERMAL METRIC(1) RθJA RθJC(top) RθJB ψJT ψJB RθJC(bot) Junction-to-ambient thermal resistance Junction-to-case (top) thermal resistance Junction-to-board thermal resistance Junction-to-top characterization parameter Junction-to-board characterization parameter ...
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5.4 Thermal Information THERMAL METRIC(1) RθJA-High K RθJC(top) RθJB ψJT ψJB RθJC(bot) Junction-to-ambient thermal resistance Junction-to-case (top) thermal resistance Junction-to-board thermal resistance Junction-to-top characterization parameter Junction-to-board characterization ...
(V) 30105 G09 30105fe 5 LT3010/LT3010-5 標準的性能特性 LT3010-5のGNDピン電流 2.0 TJ = 25°C 1.8 *FOR VOUT = 5V 1.6 RL = 100Ω 1.4 IL = 50mA* 1.2 1.0 RL = 200Ω IL = 25mA* 0.8 0.6 0.4 RL = 500Ω IL = 10mA* 0.2 RL = 5k, IL = 1mA* 0 0 1 2 3 4 5 ...
全高調波歪み + ノイズ(THD + N)の周波数特性, 100kHz フィルタ使用,差動負荷抵抗(RL, DIFF) = 5kΩ –30 DIFFERENTIAL OUTPUT VOLTAGE = 8V p-p –40 –50 –60 GAIN = 128V/V –70 –80 –90 GAIN = 8V/V –100 –11010 GAIN = 1/2V/V GAIN = 1V/V 100 1k FREQUENCY (Hz) ...
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熱抵抗 対 回路基板の銅面積 3.0 21 PowerPAD熱特性強化パッケージ OPA454は,チップとパッケージ表面間の熱抵抗(θJC)が非 常に低い,SO‑8およびHSOP‑20のPowerPAD付きで供給されて います.これらのパッケージは露出サーマルパッドを備えてい ます.このパッドはチップと直接に熱...
10.2 Layout Example WCSP Ball Via to Power/Ground Plane Via to Internal Plane MCU INT 0.1 µF 5k TMP108 Top View V+ GND A0 SCL ALERT SDA Internal Layer Trace Top/Bottom Layer Trace 5k 5k I2C Bus Figure 18. TMP108 Layout Copyright © 2013–2019, Texas Instruments Incorporated 19 TMP...