Comprising the main nonrotating functional components of the engine, the device described measures 2.1 cm/spl times/2.1 cm/spl times/0.38 cm and is largely fabricated by deep reactive ion etching through a total thickness of 3800 /spl mu/m. Complete with a set of fuel plenums, pressure ...
The extremely thick epitaxial wafer comprises a substrate and an epitaxial layer, and is characterized in that the substrate is more than 6 inches, and the thickness of the epitaxial layer is more than 100 [mu]m. The extremely thick epitaxial wafer and the method for manufacturing the same ...
Purpose – 3D chip stacking is a key technology for 3D integration in which two or more chips are stacked with vertical interconnections. In the case of mu... TF Yang,K Kao,RC Cheng,... - 《Soldering & Surface Mount Technology》 被引量: 0发表: 2012年 加载更多来源...
Control system 84 also preferably includes a disk drive DD, electronically connected to hard disk HD, memory unit MU and central processing unit CPU, wherein the disk drive is capable of accepting and reading (and even writing to) a computer-readable medium CRM, such as a floppy disk or ...
32. Mu¨ller, G., Me´tois, J.-J. & Rudolph, P. Crystal Growth-from Fundamentals to Technology (Elsevier, 2004). 33. Herman, M. A., Richter, W. & Sitter, H. Epitaxy: Physical Principles and Technical Implementation (Springer Science & Business Media, 2013). 34. Kachkanov, V. ...
J Mu?Oz,C Jimenez,A Bratov,... - 《Biosensors & Bioelectronics》 被引量: 133发表: 1997年 Low Bloom strength gelatin as a carrier for potential use in retinal sheet encapsulation and transplantation. by determinations of mechanical property, dissolution degree, melting point, cytocompatibility, bio...
{nf})=5.13\,\mu s\)per stage was measured atVDD = 3 V, wherenis the number of stages. The self-oscillation frequency of our RO is relatively low compared with previous reported results11(for discussion see Supplementary Note14), but there is a large room for future improvement ...
The invention makes it possible to anneal more wafers in a single annealing operation under a variety of conditions, including: oxygen outer diffusion annealing to form a denuded zone; annealing to control bulk micro defects and provide intrinsic gettering functions; annealing to enhance gate oxide ...
Salvatore1,*, Niko Mu¨nzenrieder1,*, Thomas Kinkeldei1, Luisa Petti1, Christoph Zysset1, Ivo Strebel1, Lars Bu¨the1 & Gerhard Tro¨ster1 Electronics on very thin substrates have shown remarkable bendability, conformability and lightness, which are important attributes for biological tissues ...
PURPOSE: To facilitate counting of extra-fine foreign substance particles on a wafer surface whose sizes are abut 0.05μm by a method wherein the object wafer is exposed to a supersaturation vapor pressure state in a condensation chamber and the sizes of the foreign substance particles are en...