After the spacer layer120is affixed to substrate102, one or more memory die130may be mounted on top of the spacer layer120and controller die116in a step220as shown in FIGS. 12 and 13. The memory die130may be for example flash memory chips (NOR/NAND), though other semiconductor die are...
Large capacity memory systems are constructed using stacked memory integrated circuits or chips. The stacked memory chips are constructed in such a way that eliminates problems such
an initiative that includes Swire, EY, PWC, KPMG, Blackrock, JP Morgan and other blue-chips. Balaji has also served as an advisory board member of theShared Value Project