US3288747 * Jun 8, 1962 Nov 29, 1966 Allied Prod Corp Molding composition of powdered epoxy resin, and filler coated with normally solid curing agentUS3288747 1962年6月8日 1966年11月29日 Allied Prod Corp Molding composition of powdered epoxy resin, and filler coated with normally solid curing...
A coating composition is a free-flowing powder (of e.g. less than 80 mesh) comprising a triphenol-A based epoxy resin and a phenolformaldehyde (novolac) based epoxy resins in the proportion 1: 1 to 20
Possibility of filler hydrophobization by treatment with organosilicon compounds as well as influence of the treatment on the composite properties has been studied. Diatomite and tripoli were used as fillers, epoxy resin as binders, and polyorganohydridesiloxane (polyethylenehydrosiloxane) liquid GKZh-...
It may contain up to 70 weight per cent of a mineral filler and/or a pigment (see Division C3). The powder may be applied by dry spraying, flame spraying, or fluidized bed techniques. In examples powders are obtained from bisphenol A and novolac epoxy resins using as hardener glycerol ...
5-12 wt.% short asbestos, polyamide or glass fibres, and 55 wt.% powdered filler, such as silica, metals, or metal oxides, and (III) an amine, polyamine or polyamide as curing agent, which cures the compsn. within 24 hrs. at the ambient temp. The resin is easily cast in situ to...
Carrier mounting epoxy TERMINOLOGY Mounting Plane of Carrier This is the plane of the electrical contact surfaces on which the carrier is mounted. The mounting plane of the carrier is not necessarily enclosed by the carrier, but may be defined by a common cut-off plane along the bottom of...
A coating composition comprises by weight (a) 100 part of an epoxy resin, e.g. a bisphenol A resin; (b) a hardener e.g. an aromatic diamine as 0.5 - 1.5 equivalent; and (c) a filler which is a mixture of 30 - 180 parts by wt. of a needle-like glass powder of average ...
in admixture with from 5 to 90 per cent by weight thereof of a particulate filler whose melting-point is substantially in excess of the temperature at which the process is conducted, which has good heat conductivity compared with the synthetic resin and which remains chemically unchanged during th...