Dimensions: [mm] 5,0 ±0,3 12,0 ±0,3 Recommended Land Pattern: [mm] Solder Resist 5,4 Electrical Properties: Properties Inductance Rated Current Saturation Current DC Resistance DC Resistance Self Resonant Frequency No vias and traces in restricted area Scale - 2:1 Certification: RoHS ...
Recommended Land Pattern Design and specifi c ations are each subject to change without notice. Ask factory for the current technical specifi c ations before purchase and/or use.Should a safety concern arise regarding this product, please be sure to contact us immediately.Surface Mount ...
Ask factory for the current technical specifi cations before purchase and/or use.Should a safety concern arise regarding this product, please be sure to contact us immediately.Surface Mount Resistors Land Pattern– 44 –cabChip ResistorabcWiring pattern(copper trace)Land patternSolder resistacbbabc...
;CONSTITUTION: This is a pattern shape of a soldering land for loading the required parts on a suitable board such as a printed board through a soldering land 1 surrounded by a solder resist layer 2 and the pattern shape where the respective soldering lands are composed by being divided into...
Land pattern Solder resist ● Anexample of a land pattern for Low Resistance Value Chip Resistors is shown below. Size mm/inch Dimensions (mm) a b c 0402/01005 0.15 to 0.20 0.5 to 0.7 0.20 to 0.25 0603/0201 0.3 to 0.4 0.8 to 0.9 0.25 to 0.35 ...
installed. It should be noted that a conductor pattern is formed on a surface of the image pickup board31. This conductor pattern is covered with a thin insulating film such as a photoresist solution to prevent shorting of the conductor (board surface layer pattern) and a conductor outside ...
a metal layer pattern plated on a portion of one end of said elongated conductor, said metal layer having an arcuate upper surface facing inward toward a midline of said metal layer; and a solder layer placed upon at least a portion of the metal layer upper surface. 2. The printed circu...
Recommended Land Pattern Design and specifi c ations are each subject to change without notice. Ask factory for the current technical specifi c ations before purchase and/or use.Should a safety concern arise regarding this product, please be sure to contact us immediately.Surface Mount ...
PURPOSE:To form a solder resist of high density and fine pattern and uniformize the film thickness by printing necessary solder resist after preliminary printing process for flattening a wiring circuit surface. CONSTITUTION:A solder resist screen corresponding to a pattern inverse to a circuit pattern...
PURPOSE:To make high density mounting possible by extending a land 1 for connection inward the surface mounting electron parts along a lead shape for making it a mark for visual position recognition, while dividing its border part with solder resist so as to remove a pattern prohibition area. ...