There is an ongoing trend shift in surface finish technology from HASL towards alternative finishes such as ENIG, immersion tin, immersion silver, and OSP (organic solderability preservative). This shift is caused by environmental concerns due to the use of lead in electronic assemblies. Immersion ...
The results of both immersion tin and novel immersion silver processes show more than acceptable solderability under various aging conditions and multiple soldering operations. The unique conditioning step prevents whiskering and extends the shelf life of the immersion tin final finish. No organic co-...
In contrast to HASL, it offers a more planar surface. For storage and handling, this surface finish needs more care than immersion tin. It is safer for the environment than immersion tin. In dry storage, this finish will last 6 to 12 months, the same as HASL boards. Boards with this ...
Hot-air leveling Hot air leveling is the process of first coating the surface of the circuit board with lead-free tin solder, and then leveling it with heated compressed air to form a layer ofcopper oxide resistant coatingon the surface. Although HASL delivers anti-oxidation at a cheap cost ...
Cheap and Good OSP Surface PCB Circuit Board ODM/OEM Service Support Professional Manufacturer 1-20 Layers 94V0 Fr4 Rigid PCB Board Immersion Gold Rigid Multilayer Printed Circuit Board PCB Finishes include: Immersion Tin (Sn) Immersion Sliver (Ag) ENIG/Immersion Gold (Au) ...
PCB surface finished: HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver Legend: White E-test: 100% AOI, X-ray, Flying probe test. Outline: Rout and Score/V-cut Inspection Standard: IPC-A-610CCLASSII Certif...
Surface finish/treatment HASL,ENIG,Chem,Tin,Flash Gold, OSP, Gold Finger Production capacity of hot-sale products Double Side/Multilayer PCB Workshop Aluminum PCB Workshop Technical Capability Technical Capability Raw materials: CEM-1, CEM-3, FR-4(High TG), Rogers...
For the PWB manufacturer the elimination of lead from their shops is well on its way. Tin has already replaced tin-lead as an etch resist. Hot air solder leveling (HASL) remains the largest source of lead in the board shop. HASL is still the choice of solderable surface finish for a va...
Specification for Immersion Tin Plating for Printed Circuit Boards active, Most Current Buy Now Organization:IPC Publication Date:1 January 2007 Status:active Page Count:56 scope: This specification sets the requirements for the use of Immersion Tin (ISn) as a surface finish for printed circuit boa...
Surface finish/treatment HASL, lead free HASL ,Immersion Gold(ENIG),Immersion Tin ,Immersion Silver, OSP, Gold plating, Gold Finger, Carbon Ink, Peelable mask Copper foil thickness 18um-280um(0.5OZ-8OZ)(normally 1OZ) Solder mask color green/black/white/red/b...