<图7>所示之LOC(Lead On Chip)型式主要用于TSOP或SOJ等两面接脚的封装型式,将导线架延伸至芯片上方,再以双面胶等黏着材料和芯片连接,好处是打线距离减少,对电性帮助较大,采用此种方式的封装方式,对TSOP 40而言热阻约可减少14℃/W。QLP(Quad Leadless Package)型式是将QFP伸出的接脚除去,由于体积减少,因此可归...
Package:QFN D/C:N/A Specification:MT7663BSN Estuvo genial la entrega en tiempo y forma todo muy correcto Hainayu Electronic fast delivery franchise integrated IC chip QFN MT7663BSN $2.00 查看商品详情 供应商回复: Thank you for your support and look forward to cooperating again ...
Transport Package Carton Specification standard Trademark RENESAS Origin Original HS Code 85423100 Production Capacity 10000PCS/Month Packaging & Delivery Package Size 10.00cm * 10.00cm * 10.00cm Package Gross Weight 1.000kg Product Description original ic chip ZSSC4151CE6R integrated cir...
the device can also be used as SMD/SMT Termination Style. In addition, the Surge Energy Rating is 1.2 J, the device is offered in MLA Series, the device has a MLV of Product, and Peak Surge Current is 280 A, and the Packaging is Digi-ReelR Alternate Packaging, and Package Case is ...
Transport Package Box Origin China HS Code 8542390000 Production Capacity 1000000PCS Product Description Description R7FA2E1A72DFL#AA0 : ARM Microcontrollers - MCU MCU RA2E1 ARM CM23 48MHZ 64K/16K QFP48 Mfr. Part#: R7FA2E1A72DFL#AA0 Mfr.: RENESAS Datasheet: (e-mail...
FE1.1 USB HUB FE1.1 USB2.0 FE1.1(LQFP48) (TERMINUS) FE1.1(LQFPpackage) FE1.1(Must be QFP48) FE1.1. FE1.1/AQFP48ATR FE1.1/QFP48 FE1.1-A FE1.1-A6 FE1.1AQFN48A FE1.1-AQFN48A FE1.1AQFP48A FE1.1-AQFP48A FE1.1-AQFP48A(USB2.0HUB FE1.1-AQFP48A(USB2.0HUB) FE1.1AQFP48AT FE...
shape hqfp64 Transport Package Box Origin China HS Code 8542399000 Production Capacity 1000000PCS Product Description Description STM32G431KBU3: ARM Microcontrollers - MCU Mainstream Arm Cortex-M4 MCU 170 MHz 128 Kbytes of Flash Math Accel Mfr. Part#: STM32G431KBU3 ...
QFNQuad flat non-leaded package (QFN). Also known as QFNL. QFPQuad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processor...
G364 F114 with EDA / CAD Models The G364 F114 is available in QFN Package, is part of the IC Chips. 技术参数 制造商 TOSHIBA 包装 Tape & Reel (TR)/Cut Tape (CT)/Tray/Tube RoHs Status Lead free / RoHS Compliant 封装/规格 QFP G36450505017 相关特供产品 料号 描述 操作...
1 - 99 pieces $0.86 100 - 999 pieces $0.48 >= 1000 pieces $0.17 Variations Total options: 1 Package;1 D/C;1 Specification. Select now 1. Package(1): DIP SOP PLCC QFP QFN BGA VSOP DIP SOP PLCC QFP QFN BGA VSOP 2. D/C(1): 2021 2022 2021 2022 3. Specification(1) ...