chemical and mechanical forces, which might damage the patterns.[ 1 ], [ 2 ] We present in this paper the chemical surface properties of wafers after different types of wet cleaning of single wafers, using notably the advanced additive technologies: HF-O3-based or SC1-like-based cleaning. An...
题目I did volunteer(志愿者) work in a Kenya orphanage(孤儿院)last year. It was an unforgettable experience. When I first went to Kenya(1) Amy classmates,I saw many poor children.I was(2) C that we might have to live like them. I was right. We had to sleep in...
The aim of this study is to propose an efficient wet cleaning of the surfaces of the SiGe virtual substrates just after a chemical mechanical polishing step. We have first of all studied the chemical compatibility of miscellaneous solutions, such as the standard cleaning 1 (SC1), the Standard ...