AD绘制双层板的时候，用于焊接DIP封装的通孔焊盘布设在multi_layer层的时候，这个焊盘在制版的时候到底会出现在顶层还是底层，还是两面都有，还…通孔，将板子贯通了，两个表面都会有焊盘 字面意思就是多层，每个层都会有焊盘和通孔。楼主，多用贴片，会爱上用贴片的，尤其是焊贴片那酸爽
1、首先在电脑上打开画图软件AD16，打开画好的PCB板。2、然后点击上方菜单选项“报告”下拉菜单中的“板子信息”选项。3、然后在出现窗口的右下角找到“报告”按钮，进行点击。4、然后在出现的窗口中只勾选“Routing Information”选项，点击“报告”按钮。5、然后在出现的报告页面中可以查看线路是否已经...
AD错误之Un-Routed Net Constraint: Unplated Pad S1-1(2.54mm,20.322mm) on Multi-Layer 问题及原因分析 问题出现在了一个三端纽子开关的封装,因为是从别处copy的,没想到出现了此等问题。 unplated 意思是没有电镀的,如果没有电镀那么顶层和底层之间是没有沉铜的,就是不连的。 解决办法 勾选对应的plated。....
您需要登录才可以下载或查看，没有帐号？注册 x 在AD中出现 “unplated multi-layer pad（s） detected...
AdaptiveSecurityforMulti-layerAd-hocNetworks JiejunKong,HaiyunLuo,KaixinXu,DanielLihuiGu Advisor:MarioGerla,SongwuLu Level1: RegularGroundNodes < > Level3: AerialMobileBackbone Structure Level2: GroundMobile Backbone Homogeneousmobilead-hocnetwork ...
摘要:Provided is a multi-layer adhesive tape having no interfacial separation between layers even in a cryogenic atmosphere. The multi-layer adhesive tape sequentially comprises a first outer adhesive layer, a middle adhesive layer, and a second outer adhesive layer, wherein the multi-layer adhesive...
A multi-layer phase change material, including: a multi-layer film structure. The multi-layer film structure includes a plurality of periodic units. The periodic units each includes a first single-layer film phase change material and a second single-layer film phase change...
In Section 3 we present our cross-layer framework based on a probabilistic network model. Section 4 formulates routing and resource allocation in an ad hoc network as a multiobjective optimization problem and Section 5 discusses an example for sensor networks. Results and analysis for two problem...
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RADIO FREQUENCY (RF) COMPONENTS - MULTI-LAYER DIPL •All specifications are subject to change without notice.•Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB...