The tested components were CSPs with Sn-Ag-Cu-Bi solder balls, TSOPs with some platings, and Chip components with some platings. The evaluation was carried out by the temperature cycle test (TCT). As the results, in case of CSPs, we obtained good joint resistance even after TCT 2000...
PROBLEM TO BE SOLVED: To provide an Au-Sn alloy solder paste which can be joined at a low temperature of≤280°C, and by which an Au-Sn alloy solder formed thereby is not melted even upon second reflow by an Sn-Ag based lead-free solder, has gentle joining to an LED element, also...
回路 基板の鉛フリーはんだ付けまたはリフローはんだ付けにおいて、一部のはんだ接合部の部分足のはんだ付け可能なフィルムがまだ遷移期間の間に錫-鉛または鉛-錫-鉛処理層(Sn 36 Pb 2 Ag、177℃)を使用している場合、その後、固化工程中に半田接合を形成する。少量のリードは、押し出されて、PCB...